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GigaDevice Semicon Beijing GD32F330F8P6TR product image
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GigaDevice Semicon Beijing GD32F330F8P6TR

Manufacturer
MPN
GD32F330F8P6TR
LCSC Part #
C179650
Packaging
TSSOP-20
Customer #
Key Attributes
ARM Cortex-M4 32-bit MCU
DatasheetGigaDevice Semicon Beijing GD32F330F8P6TR
Alternative Parts1
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In-Stock: 2,846
2,846 In stock, ships now
Minimum: 1Multiple: 1Sales Unit: Piece
Add to BOM List
QtyUnit PriceTotal Amount
1+$ 0.648$ 0.65
10+$ 0.6316$ 6.32
30+$ 0.6201$ 18.60
100+$ 0.6086$ 60.86
Standard Packaging3000/Full Reel
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Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerGigaDevice Semicon Beijing
PackagingTSSOP-20
DAC (Bit)-
ADC (Bit)12bit
Number of I/O15
Operating Temperature-40℃~+85℃
Voltage - Supply2.6V~3.6V
Program Memory TypeFLASH
EEPROM-
Program Storage Size64KB
CPU CoreARM Cortex-M4
Core Size32 Bit
CPU Maximum Speed84MHz
Oscillator TypeBuilt-in+External

Introduction

AI Translation

The GD32F330xx device belongs to the value line of GD32 MCU family. It is a new 32-bit general-purpose microcontroller based on the ARM® Cortex®-M4 RISC core with best costperformance ratio in terms of enhanced processing capacity, reduced power consumption and peripheral set. The Cortex®-M4 core features implements a full set of DSP instructions to address digital signal control markets that demand an efficient, easy-to-use blend of control and signal processing capabilities. It also provides a Memory Protection Unit (MPU) and powerful trace technology for enhanced application security and advanced debug support. The GD32F330xx device incorporates the ARM® Cortex®-M4 32-bit processor core operating at 84 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 128 KB on-chip Flash memory and up to 16 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer one 12-bit ADC, up to five general-purpose 16-bit timers, a general-purpose 32-bit timer, a PWM advanced-control timer, as well as standard and advanced communication interfaces: up to two SPIs, two I²Cs, two USARTs. The device operates from a 2.6 to 3.6 V power supply and available in -40 to +85 ℃ temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications.

Alternative Parts

MPNManufacturerAlternative TypePackagingAvailabilityUnit Price
GD32F310F8P6TRGigaDevice Semicon BeijingSimilarTSSOP-203,703$ 1.0987
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