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SiTime SIT1532AI-J4-DCC-32.768D product image
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SiTime SIT1532AI-J4-DCC-32.768DRoHS

Manufacturer
MPN
SIT1532AI-J4-DCC-32.768D
LCSC Part #
C367053
Packaging
SMD1508-4P
Customer #
Key Attributes
LVCMOS OSC 32.768kHz SMD1508-4P
Datasheetpdf iconSiTime SIT1532AI-J4-DCC-32.768D
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QtyUnit Price(Reference Only)Total Amount
1+$ 0.9655$ 0.97
10+$ 0.7903$ 7.90
30+$ 0.6945$ 20.84
100+$ 0.5858$ 58.58
Standard Packaging3000/Full Reel
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Products Specifications

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TypeDescription
CategoryPassives/Crystals, Oscillators, Resonators/Oscillators
ManufacturerSiTime
PackagingSMD1508-4P
Current - Supply1.4uA
Operating Temperature-40℃~+85℃
Frequency Stability±100ppm
Output TypeLVCMOS
Frequency32.768kHz
Voltage - Supply1.5V~3.63V

Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging3000
Sales UnitPiece

Introduction

AI Translation

The SiT1532 is the smallest, lowest power 32 kHz oscillator optimized for mobile and other battery-powered applications. Silicon MEMS technology enables the smallest footprint and chip-scale packaging. This device reduces the 32 kHz footprint by as much as 85% compared to existing 2.0x1.2 mm SMD XTAL packages. Unlike XTALs, the SiT1532 oscillator output enables greater component placement flexibility and eliminates external load capacitors, thus saving additional component count and board space. And unlike standard oscillators, the SiT1532 features NanoDrive™, a factory programmable output that reduces the voltage swing to minimize power. The 1.2V to 3.63V operating supply voltage range makes it an ideal solution for mobile applications that incorporate a low-voltage, battery-back-up source such as a coin-cell or super-cap. SiTime’s MEMS oscillators consist of MEMS resonators and a programmable analog circuit. The MEMS resonators are built with SiTime’s unique MEMS First™ process. A key manufacturing step is EpiSeal™ during which the MEMS resonator is annealed with temperatures over 1000℃. EpiSeal creates an extremely strong, clean, vacuum chamber that encapsulates the MEMS resonator and ensures the best performance and reliability. During EpiSeal, a poly silicon cap is grown on top of the resonator cavity, which eliminates the need for additional cap wafers or other exotic packaging. As a result, SiTime’s MEMS resonator die can be used like any other semiconductor die. One unique result of SiTime’s MEMS First and EpiSeal manufacturing processes is the capability to integrate SiTime’s MEMS die with a SOC, ASIC, microprocessor or analog die within a package to eliminate external timing components and provide a highly integrated, smaller, cheaper solution to the customer.

Features

AI Translation
  • Smallest footprint in chip-scale (CSP): 1.5x0.8 mm
  • Fixed 32.768 kHz
  • < 10 ppm frequency tolerance
  • Ultra-low power: <1 μA
  • Directly interfaces to XTAL inputs
  • Supports coin-cell or super-cap battery backup voltages
  • Vdd supply range: 1.5V to 3.63V over -40℃ to +85℃
  • Oscillator output eliminates external load caps
  • Internal filtering eliminates external Vdd bypass cap
  • NanoDrive™ programmable output swing for lowest power
  • Pb-free, RoHS and REACH compliant

Applications

AI Translation
  • Mobile Phones
  • Tablets
  • Health and Wellness Monitors
  • Fitness Watches
  • Sport Video Cams
  • Ultra-Small Notebook PC
  • Pulse-per-Second (pps) Timekeeping
  • RTC Reference Clock
  • Battery Management
  • Timekeeping