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ST STM32H7A3IGT6 product image
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ST STM32H7A3IGT6RoHS

Manufacturer
ST
MPN
STM32H7A3IGT6
LCSC Part #
C730216
Packaging
LQFP-176(24x24)
Customer #
Key Attributes
High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1MBytes of Flash memory, 1376 KB SRAM, 280 MHz CPU, L1 cache, graphic accelerations, external memory interfaces and large set of peripherals
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QtyUnit Price(Reference Only)Total Amount
1+$ 17.52$ 17.52
200+$ 6.7805$ 1356.10
400+$ 6.5428$ 2617.12
800+$ 6.424$ 5139.20
Standard Packaging400/Full Tray
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Products Specifications

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TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerST
PackagingLQFP-176(24x24)
DAC (Bit)12bit
ADC (Bit)8bit;16bit
Operating Temperature-40℃~+85℃
Program Memory TypeFLASH
Voltage - Supply1.62V~3.6V
EEPROM-
Program Storage Size1MB
CPU CoreARM Cortex-M7
Core Size32 Bit
CPU Maximum Speed280MHz
Oscillator TypeBuilt-in+External
Number of I/O138
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Additional Information

TypeDetails
Minimum1
Multiple1
Standard Packaging400
Sales UnitPiece

Features

AI Translation
  • LQFP64 (10 x 10 mm) LQFP100 (14 x 14 mm) LQFP144 (20x20 mm) LQFP176 (24 x 24 mm)
  • TFBGA100 (8 x 8 mm) TFBGA216 (13x13 mm) TFBGA225 (13x13 mm)
  • 32-bit Arm Cortex-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • UFBGA169 (7x7 mm) UFBGA176+25 (10x10 mm)
  • WLCSP132 (4.57 X 4.37 mm)
  • Up to 2 Mbytes of Flash memory with read while write support, plus 1 Kbyte of OTP memory
  • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
  • 2x Octo-SPI memory interfaces, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
  • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous mode SDRAM/LPSDR SDRAM 8/16-bit NAND Flash memories
  • CRC calculation unit
  • ROP, PC-ROP, active tamper, secure firmware upgrade support
  • Up to 168 I/O ports with interrupt capability Fast I/Os capable of up to 133 MHz Up to 164 5-V-tolerant I/Os
  • Stop: down to 32 μA with full RAM retention Standby: 2.8 μA (Backup SRAM OFF, RTC/LSE ON, PDR OFF) VBAT: 0.8 μA (RTC and LSE ON)
  • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI External oscillators: 4-50 MHz HSE, 32.768 kHz LSE 3x PLLs (1 for the system clock, 2 for kernel clocks) with fractional mode
  • 2 separate power domains, which can be independently clock gated to maximize power efficiency: CPU domain (CD) for Arm Cortex core and its peripherals, which can be independently switched in Retention mode Smart run domain (SRD) for reset and clock control, power management and some peripherals
  • 1.62 to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
  • Dedicated SDMMC power supply
  • High power efficiency SMPS step-down converter regulator to directly supply VCORE or an external circuitry
  • Embedded regulator (LDO) with configurable scalable output to supply the digital circuitry
  • Voltage scaling in Run and Stop mode
  • Backup regulator (~0.9 V)
  • Low-power modes: Sleep, Stop and Standby
  • VBAT battery operating mode with charging capability
  • CPU and domain power state monitoring pins
  • 3 bus matrices (1 AXI and 2 AHB) Bridges (5x AHB2APB, 3x AXI2AHB)
  • 5 DMA controllers to unload the CPU
  • 1x high-speed general-purpose master direct memory access controller (MDMA)
  • 2x dual-port DMAs with FIFO and request router capabilities
  • 1x basic DMA with request router capabilities
  • 1x basic DMA dedicated to DFSDM
  • Up to 35 communication peripherals
  • 4x I2C FM+ interfaces (SMBus/PMBus)
  • 5x USART/5x UARTs (ISO7816 interface, LIN, IrDA, modem control) and 1x LPUART
  • 6x SPIs, including 4 with muxed full-duplex I2S audio class accuracy via internal audio PLL or external clock and 1x SPI/I2S in LP domain (up to 125 MHz)
  • 2x SAIs (serial audio interface)
  • SPDIFRX interface
  • SWPMI single-wire protocol master interface
  • MDIO Slave interface
  • 2x SD/SDIO/MMC interfaces (up to 133 MHz)
  • 2x CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
  • 1x USB OTG interfaces (1HS/FS)
  • HDMI-CEC
  • 8- to 14-bit camera interface up to 80 MHz
  • 8-/16-bit parallel synchronous data input/output slave interface (PSSI)
  • 11 analog peripherals
  • 2x ADCs with 16-bit max. resolution (up to 24 channels, up to 3.6 MSPS)
  • 1x analog and 1x digital temperature sensors
  • 1x12 -bit single-channel DAC (in SRD domain) + 1x 12 -bit dual-channel DAC
  • 2x ultra-low-power comparators
  • 2x operational amplifiers (8 MHz bandwidth)
  • 2x digital filters for sigma delta modulator (DFSDM), 1x with 8 channels/8 filters and 1x in SRD domain with 2 channels/1 filter
  • LCD-TFT controller up to XGA resolution
  • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load
  • Hardware JPEG Codec
  • Chrom-GRC (GFXMMU)
  • Up to 19 timers and 2 watchdogs
  • 2x32 -bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 280 MHz)
  • 2x16 -bit advanced motor control timers (up to 280 MHz)
  • 10x 16-bit general-purpose timers (up to 280 MHz)
  • 3x16 -bit low-power timers (up to 280 MHz)
  • 2x watchdogs (independent and window)
  • 1x SysTick timer
  • RTC with sub-second accuracy and hardware calendar
  • SWD and JTAG interfaces 4 KB Embedded Trace Buffer
  • 96-bit unique ID All packages are ECOPACK2 compliant