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ST STM32F427VGT6 product image
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ST STM32F427VGT6

Manufacturer
MPN
STM32F427VGT6
LCSC Part #
C117815
Packaging
LQFP-100(14x14)
Customer #
Key Attributes
High-performance advanced series ARM Cortex-M4 MCU with DSP and FPU, featuring 1 MB Flash, 180 MHz CPU, ART accelerator, Chrom-ART accelerator, and FSMC
DatasheetST STM32F427VGT6
RoHS Compliance3 documents available
Alternative Parts5
Every Order Guarantee
100% Authentic · 30-Day Return or Replacement

Products Specifications

All
TypeDescription
CategoryIntegrated Circuits (ICs)/Embedded/Microcontrollers
ManufacturerST
PackagingLQFP-100(14x14)
DAC (Bit)12bit
ADC (Bit)12bit
Number of I/O82
Operating Temperature-40℃~+85℃
Voltage - Supply1.8V~3.6V
Program Memory TypeFLASH
EEPROM-
Program Storage Size1MB
CPU CoreARM Cortex-M4
Core Size32 Bit
CPU Maximum Speed180MHz
Oscillator TypeBuilt-in

Introduction

AI Translation

ARM Cortex-M4 32-bit MCU+FPU, 225DMIPS, up to 2MB Flash/256+4KB RAM, with USB OTG HS/FS, Ethernet, 17 timers, 3 ADCs, 20 communication interfaces, camera and LCD-TFT support.

Features

AI Translation
  • Core: ARM 32-bit Cortex-M4 CPU with FPU, ART Accelerator™ for zero-wait-state Flash execution, up to 180MHz, MPU, 225DMIPS/1.25DMIPS/MHz (Dhrystone 2.1), DSP instruction set support.
  • Memory: Up to 2MB Flash (dual-bank read-while-write); up to 256+4KB SRAM (including 64KB CCM data RAM); flexible external memory controller (supports SRAM, PSRAM, SDRAM/LPSDR SDRAM, Compact Flash/NOR/NAND).
  • LCD Interface: LCD parallel interface compatible with 8080/6800 modes; LCD-TFT controller up to XGA resolution with dedicated Chrom-ART Accelerator™ (DMA2D) for enhanced graphics rendering.
  • Clock, Reset & Power Management: 1.7V to 3.6V supply and I/Os; POR, PDR, PVD, and BOR; 4 to 26MHz crystal oscillator; factory-trimmed internal 16MHz RC oscillator (1% accuracy); 32kHz RTC oscillator with calibration; internal 32kHz RC oscillator with calibration.
  • Low Power: Sleep, Stop, and Standby modes; V_BAT supply for RTC, 20×32-bit backup registers + optional 4KB backup SRAM.
  • ADC & DAC: Three 12-bit 2.4MSPS ADCs (up to 24 channels, triple interleaved mode up to 7.2MSPS); two 12-bit DACs.
  • DMA & Timers: General-purpose DMA (16 streams with FIFO and burst support); up to 17 timers (twelve 16-bit, two 32-bit running up to 180MHz, each with 4 input capture/output compare/PWM or pulse counter and quadrature encoder input).
  • Debug: SWD & JTAG; Cortex-M4 Trace Macrocell™.
  • Packages: LQFP100 (14×14mm), LQFP144 (20×20mm), LQFP176 (24×24mm), LQFP208 (28×28mm), UFBGA169 (7×7mm), UFBGA176 (10×10mm), TFBGA216 (13×13mm), WLCSP143.
  • I/O Ports: Up to 168 I/Os with interrupt capability; up to 164 fast I/Os (up to 90MHz); up to 166 5V-tolerant I/Os.
  • Communication Interfaces: Up to 21 communication interfaces, including 3× I2C (SMBus/PMBus), 4× USART/4× UART (11.25Mbit/s, ISO7816, LIN, IrDA, modem control), 6× SPI (45Mbit/s), 2× full-duplex I2S (audio-class accuracy via internal audio PLL or external clock), 1× SAI (Serial Audio Interface), 2× CAN (2.0B Active), and SDIO interface.
  • Advanced Connectivity: USB 2.0 full-speed device/host/OTG controller with on-chip PHY; USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY, and ULPI; 10/100 Ethernet MAC with dedicated DMA (IEEE 1588v2 hardware support, MII/RMII).
  • Other Features: 8~14-bit parallel camera interface (up to 54MB/s); true random number generator; CRC calculation unit; RTC (sub-second accuracy, hardware calendar); 96-bit unique ID.