NAND FLASH
The Results of NAND FLASH
2356
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2356
Images
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Pricing
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Quantity
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Availability
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Mfr.Part #
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Manufacturer
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Description
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RoHS
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LCSC Part#
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Package
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Packaging
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Operating Temperature
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Interface Type
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Write Cycle Time (tWC)
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Supply Voltage
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Memory Size
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|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Interface Type
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Memory Size
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS21TF08G-JQLI-TR | ISSI(Integrated Silicon Solution) | LFBGA-100(14x18) NAND FLASH ROHS | C17264972 | LFBGA-100(14x18) | Tape & Reel (TR) | - | - | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | MT29F1G08ABAEAM68M3WC1L | Micron Tech | 2.7V~3.6V 1Gbit NAND FLASH ROHS | C17266382 | - | Bag-packed | 0℃~+70℃ | - | - | 2.7V~3.6V | 1Gbit | ||
| | Min: 1 Mult: 1 | 0 | W25N02KWZEIU | Winbond Elec | 1.7V~1.95V 2Gbit WSON-8(6x8) NAND FLASH ROHS | C17268544 | WSON-8(6x8) | Tube-packed | -40℃~+85℃ | SPI | 700us | 1.7V~1.95V | 2Gbit | ||
| | Min: 1 Mult: 1 | 0 | W74M12JVSSIQ | Winbond Elec | 2.7V~3.6V 128Mbit SOIC-8-208mil NAND FLASH ROHS | C7389715 | SOIC-8-208mil | Tube-packed | -40℃~+85℃ | SPI | - | 2.7V~3.6V | 128Mbit | ||
| | Min: 1 Mult: 1 | 0 | AF064GEC5X-2001EX | ATP Electronics, Inc. | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17181703 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | - | 512Gbit | ||
| | Min: 1 Mult: 1 | 0 | AF064GEC5A-2001IX | ATP Electronics, Inc. | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17216779 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | - | - | - | 512Gbit | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | W25N02JWTBIC TR | Winbond Elec | 1.7V~1.95V 2Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17220702 | TFBGA-24(6x8) | Tape & Reel (TR) | -40℃~+85℃ | SPI | 700us | 1.7V~1.95V | 2Gbit | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N01GVSFIG TR | Winbond Elec | 2.7V~3.6V 1Gbit SOIC-16-300mil NAND FLASH ROHS | C17287125 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | SPI | 700us | 2.7V~3.6V | 1Gbit | ||
| | Min: 1 Mult: 1 | 0 | TH58NYG3S0HBAI4 | KIOXIA | 1.7V~1.95V 8Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17235551 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | Parallel Port | 25ns | 1.7V~1.95V | 8Gbit | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0  | ASFC4G31M-51BINTR | Alliance Memory | 2.7V~3.6V 32Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17236921 | FBGA-153(11.5x13) | Tape & Reel (TR) | -40℃~+85℃ | - | - | 2.7V~3.6V | 32Gbit | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5X-2001A2 | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17229201 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | - | 256Gbit | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS22TF128G-JQLA1-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 1Tbit LFBGA-100(14x18) NAND FLASH ROHS | C17230318 | LFBGA-100(14x18) | Tape & Reel (TR) | -40℃~+85℃ | - | - | 2.7V~3.6V | 1Tbit | ||
| | Min: 1 Mult: 1 | 0 | SM671PAF-BFSS | Silicon Motion | 4Tbit BGA-153(11.5x13) NAND FLASH ROHS | C17260358 | BGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | - | - | - | 4Tbit | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTG7-T14-16 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17259836 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | - | - | 2.7V~3.6V | 64Gbit | ||
| | Min: 1 Mult: 1 | 0 | W25N01GWTCIG | Winbond Elec | 1.7V~1.95V 1Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17295093 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | SPI | 700us | 1.7V~1.95V | 1Gbit | ||
| | Min: 1 Mult: 1 | 0 | FEMC032GTTE7-T13-26 | Flexxon | 2.7V~3.6V 256Gbit FBGA-100(14x18) NAND FLASH ROHS | C17292244 | FBGA-100(14x18) | Tray | -40℃~+85℃ | - | - | 2.7V~3.6V | 256Gbit | ||
| | Min: 1 Mult: 1 | 0 | TH58BYG3S0HBAI4 | KIOXIA | 1.7V~1.95V 8Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17293323 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | Parallel Port | 25ns | 1.7V~1.95V | 8Gbit | ||
| | Min: 1 Mult: 1 | 0 | MX30UF4G28AD-XKI | MXIC(Macronix) | 1.7V~1.95V 4Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17338797 | VFBGA-63(9x11) | Tray | -40℃~+85℃ | - | 25ns | 1.7V~1.95V | 4Gbit | ||
| | Min: 1 Mult: 1 | 0 | AF064GEC5X-2001IX | ATP Electronics, Inc. | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17310673 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | - | - | - | 512Gbit | ||
| | Min: 1 Mult: 1 | 0 | SFEM032GB2ED1TO-I-5E-111-STD | Swissbit | 2.7V~3.6V 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17318552 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | - | - | 2.7V~3.6V | 256Gbit | ||
| | Min: 1 Mult: 1 | 0 | IS22TF128G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 1Tbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17337569 | VFBGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | - | - | 2.7V~3.6V | 1Tbit | ||
| | Min: 1 Mult: 1 | 0 | W29N04GVSIAF | Winbond Elec | 2.7V~3.6V 4Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17347738 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | Parallel Port | 25ns | 2.7V~3.6V | 4Gbit | ||
| | Min: 1 Mult: 1 | 0 | W25N512GVFIR | Winbond Elec | 2.7V~3.6V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17517546 | SOIC-16-300mil | Tray | -40℃~+85℃ | SPI | 700us | 2.7V~3.6V | 512Mbit | ||
| | Min: 1 Mult: 1 | 0 | W25N512GWEIR | Winbond Elec | 1.7V~1.95V 512Mbit WSON-8(6x8) NAND FLASH ROHS | C17526469 | WSON-8(6x8) | Tray | -40℃~+85℃ | SPI | 700us | 1.7V~1.95V | 512Mbit | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | IS34ML02G081-TLI-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17490289 | TFSOP-48-18.4mm | Tape & Reel (TR) | -40℃~+85℃ | Parallel Port | 25ns | 2.7V~3.6V | 2Gbit |