NAND FLASH
The Results of NAND FLASH
2356
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2356
Images
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Pricing
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Quantity
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Availability
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Mfr.Part #
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Manufacturer
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Description
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RoHS
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LCSC Part#
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Package
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Packaging
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Operating Temperature
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Supply Voltage
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Write Cycle Time (tWC)
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Memory Size
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Interface Type
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|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Supply Voltage
|
Write Cycle Time (tWC)
|
Memory Size
|
Interface Type
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1 | 0 | W29N04KZBIBF | Winbond Elec | 1.7V~1.95V 4Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17534794 | VFBGA-63(9x11) | Tray | -40℃~+85℃ | 1.7V~1.95V | 35ns | 4Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | TH58NYG2S3HBAI6 | KIOXIA | 1.7V~1.95V 4Gbit BGA-63(9x11) NAND FLASH ROHS | C17553022 | BGA-63(9x11) | Tray | -40℃~+85℃ | 1.7V~1.95V | 25ns | 4Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | IS22TF08G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17557746 | VFBGA-153(11.5x13) | Tray | -40℃~+105℃ | 2.7V~3.6V | - | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W29N02KVDIAE | Winbond Elec | 2.7V~3.6V 2Gbit VFBGA-48(8x6.5) NAND FLASH ROHS | C17532888 | VFBGA-48(8x6.5) | Tray | -40℃~+85℃ | 2.7V~3.6V | 25ns | 2Gbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 4000
| 0 | W25N512GWEIR TR | Winbond Elec | 1.7V~1.95V 512Mbit WSON-8(6x8) NAND FLASH ROHS | C17479457 | WSON-8(6x8) | Tape & Reel (TR) | -40℃~+85℃ | 1.7V~1.95V | 700us | 512Mbit | SPI | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | W29N01HZSINF TR | Winbond Elec | 1.7V~1.95V 1Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17541728 | TFSOP-48-18.4mm | Tape & Reel (TR) | -40℃~+85℃ | 1.7V~1.95V | 25ns | 1Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | IS34ML02G084-BLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 2Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17542385 | VFBGA-63(9x11) | Bag-packed | -40℃~+85℃ | 2.7V~3.6V | 25ns | 2Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | TC58BYG2S0HBAI4 | KIOXIA | 1.7V~1.95V 4Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17538552 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 1.7V~1.95V | 25ns | 4Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | MT29F4G08ABAFAM70A3WC1 | Micron Tech | 2.7V~3.6V 4Gbit NAND FLASH ROHS | C17684809 | - | Bag-packed | -40℃~+105℃ | 2.7V~3.6V | - | 4Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | IS37SML01G1-MLI-TY | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 1Gbit SOIC-16-300mil NAND FLASH ROHS | C17681575 | SOIC-16-300mil | Tray | -40℃~+85℃ | 2.7V~3.6V | - | 1Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | MT29F1G08ABBEAM68M3WC1L | Micron Tech | 1.7V~1.95V 1Gbit NAND FLASH ROHS | C17460937 | - | Bag-packed | 0℃~+70℃ | 1.7V~1.95V | - | 1Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | AF128GEC5X-2001IX | ATP Electronics, Inc. | 1Tbit BGA-153(11.5x13) NAND FLASH ROHS | C17460871 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | - | - | 1Tbit | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC00K032-AT | Insignis Technology Corporation | 3.3V 256Gbit BGA-100(14x18) NAND FLASH ROHS | C17608163 | BGA-100(14x18) | Tray | -40℃~+85℃ | 3.3V | - | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC128GBB-E540 | Flexxon | 2.7V~3.6V 1Tbit FBGA-153(11.5x13) NAND FLASH ROHS | C17587974 | FBGA-153(11.5x13) | Tray | -40℃~+105℃ | 2.7V~3.6V | - | 1Tbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N01JWSFIG TR | Winbond Elec | 1.7V~1.95V 1Gbit SOIC-16-300mil NAND FLASH ROHS | C17471425 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 1.7V~1.95V | 700us | 1Gbit | SPI | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | W29N01HVSINA TR | Winbond Elec | 1.65V~1.95V 16Mbit TFSOP-48-18.4mm NAND FLASH ROHS | C17562976 | TFSOP-48-18.4mm | Tape & Reel (TR) | -40℃~+85℃ | 1.65V~1.95V | - | 16Mbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | W25N01JWZEIG | Winbond Elec | 1.7V~1.95V 1Gbit WSON-8(6x8) NAND FLASH ROHS | C17584941 | WSON-8(6x8) | Tray | -40℃~+85℃ | 1.7V~1.95V | 700us | 1Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | FEMC016GBG-T340 | Flexxon | 2.7V~3.6V 128Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17567957 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 2.7V~3.6V | - | 128Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC53T016-IT | Insignis Technology Corporation | 2.7V~3.6V 128Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17422446 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 2.7V~3.6V | - | 128Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W29N02KZDIBF | Winbond Elec | 1.7V~1.95V 2Gbit VFBGA-48(8x6.5) NAND FLASH ROHS | C17381623 | VFBGA-48(8x6.5) | Tray | -40℃~+85℃ | 1.7V~1.95V | 25ns | 2Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | FEMC016GCG-T340 | Flexxon | 2.7V~3.6V 128Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17424309 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 2.7V~3.6V | - | 128Gbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS21TF16G-JQLI-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 128Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17429940 | LFBGA-100(14x18) | Tape & Reel (TR) | -40℃~+85℃ | 2.7V~3.6V | - | 128Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W29N04KZSIBG | Winbond Elec | 1.7V~1.95V 4Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17398894 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 1.7V~1.95V | 35ns | 4Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC032GCG-T340 | Flexxon | 2.7V~3.6V 256Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17368206 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 2.7V~3.6V | - | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W25N512GWFIR | Winbond Elec | 1.7V~1.95V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17370512 | SOIC-16-300mil | Tray | -40℃~+85℃ | 1.7V~1.95V | 700us | 512Mbit | SPI |