NAND FLASH
The Results of NAND FLASH
2356
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2356
Images
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Pricing
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Quantity
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Availability
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Mfr.Part #
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Manufacturer
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Description
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RoHS
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LCSC Part#
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Package
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Packaging
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Operating Temperature
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Write Cycle Time (tWC)
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Supply Voltage
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Memory Size
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Interface Type
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|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Memory Size
|
Interface Type
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS22TF08G-JQLA1-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17450289 | LFBGA-100(14x18) | Tape & Reel (TR) | -40℃~+85℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | TH58BVG2S3HBAI6 | KIOXIA | 2.7V~3.6V 4Gbit VFBGA-67(6.5x8) NAND FLASH ROHS | C17445998 | VFBGA-67(6.5x8) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 4Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC016GBG-T340 | Flexxon | 2.7V~3.6V 128Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17567957 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | - | 2.7V~3.6V | 128Gbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | W29N01HVSINA TR | Winbond Elec | 1.65V~1.95V 16Mbit TFSOP-48-18.4mm NAND FLASH ROHS | C17562976 | TFSOP-48-18.4mm | Tape & Reel (TR) | -40℃~+85℃ | - | 1.65V~1.95V | 16Mbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | MT29F1G08ABBEAM68M3WC1L | Micron Tech | 1.7V~1.95V 1Gbit NAND FLASH ROHS | C17460937 | - | Bag-packed | 0℃~+70℃ | - | 1.7V~1.95V | 1Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W25N02KVTBIU | Winbond Elec | 2.7V~3.6V 2Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17580511 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 700us | 2.7V~3.6V | 2Gbit | SPI | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | IS21TF32G-JCLI-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 256Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17595275 | VFBGA-153(11.5x13) | Tape & Reel (TR) | -40℃~+85℃ | - | 2.7V~3.6V | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | IS21TF64G-JCLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 512Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17592361 | VFBGA-153(11.5x13) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 512Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GCG-T340 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17591537 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | W29N02KVSIAE TR | Winbond Elec | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17594628 | TFSOP-48-18.4mm | Tape & Reel (TR) | -40℃~+85℃ | 25ns | 2.7V~3.6V | 2Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W25N01JWZEIG | Winbond Elec | 1.7V~1.95V 1Gbit WSON-8(6x8) NAND FLASH ROHS | C17584941 | WSON-8(6x8) | Tray | -40℃~+85℃ | 700us | 1.7V~1.95V | 1Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | IS22TF08G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17557746 | VFBGA-153(11.5x13) | Tray | -40℃~+105℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | TH58NVG2S3HTAI0 | KIOXIA | 2.7V~3.6V 4Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17572207 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 25ns | 2.7V~3.6V | 4Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | NSEC00K008-IT | Insignis Technology Corporation | 3.3V 64Gbit BGA-100(14x18) NAND FLASH ROHS | C17650146 | BGA-100(14x18) | Tray | -40℃~+85℃ | - | 3.3V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | SM671PXE-BFSS | Silicon Motion | 640Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17651361 | BGA-153(11.5x13) | Bag-packed | -25℃~+85℃ | - | - | 640Gbit | UFS2.1 | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N01JWSFIT TR | Winbond Elec | 1.7V~1.95V 1Gbit SOIC-16-300mil NAND FLASH ROHS | C17652060 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 700us | 1.7V~1.95V | 1Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | MT29F4G01ABBFDM70A3WC1 | Micron Tech | 1.7V~1.95V 4Gbit NAND FLASH ROHS | C17652235 | - | Bag-packed | -40℃~+85℃ | - | 1.7V~1.95V | 4Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | W25N02KVTBIR | Winbond Elec | 2.7V~3.6V 2Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17653730 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 700us | 2.7V~3.6V | 2Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | W25N04KWTBIU | Winbond Elec | 1.7V~1.95V 4Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17695419 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 700us | 1.7V~1.95V | 4Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | W25N01GVZEIT | Winbond Elec | 2.7V~3.6V 1Gbit WSON-8(6x8) NAND FLASH ROHS | C17656808 | WSON-8(6x8) | Tray | -40℃~+85℃ | 700us | 2.7V~3.6V | 1Gbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | TH58NVG4S0HTAK0 | KIOXIA | 2.7V~3.6V 16Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17686573 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 25ns | 2.7V~3.6V | 16Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | W25N512GWFIR | Winbond Elec | 1.7V~1.95V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17370512 | SOIC-16-300mil | Tray | -40℃~+85℃ | 700us | 1.7V~1.95V | 512Mbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | SM671PEC-BFST | Silicon Motion | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17336303 | BGA-153(11.5x13) | Bag-packed | -40℃~+85℃ | - | - | 512Gbit | UFS2.1 | ||
| | Min: 1 Mult: 1 | 0 | IS22TF128G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 1Tbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17337569 | VFBGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | - | 2.7V~3.6V | 1Tbit | - | ||
| | Min: 1 Mult: 1 | 0 | MX30UF4G28AD-XKI | MXIC(Macronix) | 1.7V~1.95V 4Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17338797 | VFBGA-63(9x11) | Tray | -40℃~+85℃ | 25ns | 1.7V~1.95V | 4Gbit | - |