NAND FLASH
The Results of NAND FLASH
2361
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2361
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Memory Size
|
Interface Type
|
|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Memory Size
|
Interface Type
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1 | 0 | IS21TF08G-JQLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17374242 | LFBGA-100(14x18) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTG7-T13-16 | Flexxon | 2.7V~3.6V 64Gbit FBGA-100(14x18) NAND FLASH ROHS | C17367141 | FBGA-100(14x18) | Tray | -25℃~+85℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | IS22TF16G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 128Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17367390 | VFBGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | - | 2.7V~3.6V | 128Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | W29N02KZDIBE | Winbond Elec | 1.7V~1.95V 2Gbit VFBGA-48(8x6.5) NAND FLASH ROHS | C17360518 | VFBGA-48(8x6.5) | Tray | -40℃~+85℃ | 25ns | 1.7V~1.95V | 2Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5X-2001EX | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17359509 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | IS21TF08G-JCLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17293707 | VFBGA-153(11.5x13) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | AF016GEC5A-2001EX | ATP Electronics, Inc. | 128Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17292999 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | 128Gbit | - | ||
| | Min: 1 Mult: 1 | 0  | S34MS01G204BHI013 | Infineon/Cypress Semicon | 1.7V~1.95V 1Gbit BGA-63(9x11) NAND FLASH ROHS | C17334294 | BGA-63(9x11) | Bag-packed | -40℃~+85℃ | 45ns | 1.7V~1.95V | 1Gbit | Parallel Port | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | GD25Q20ESIGR | GigaDevice Semicon Beijing | 2.7V~3.6V 2Mbit SOIC-8-208mil NAND FLASH ROHS | C17338448 | SOIC-8-208mil | Tape & Reel (TR) | -40℃~+85℃ | 70us | 2.7V~3.6V | 2Mbit | SPI | ||
| | Min: 1 Mult: 1 | 0 | AF008GEC5A-2001A2 | ATP Electronics, Inc. | 64Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17325974 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | 64Gbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS22TF32G-JQLA1-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 256Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17197217 | LFBGA-100(14x18) | Tape & Reel (TR) | -40℃~+85℃ | - | 2.7V~3.6V | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5A-2001A2 | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17241118 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | MT29F4G08ABBFAM70A3WC1 | Micron Tech | 1.7V~1.95V 4Gbit NAND FLASH ROHS | C17281852 | - | Bag-packed | 0℃~+70℃ | - | 1.7V~1.95V | 4Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | W29N04KZBIBG | Winbond Elec | 1.7V~1.95V 4Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17275573 | VFBGA-63(9x11) | Tray | -40℃~+85℃ | 35ns | 1.7V~1.95V | 4Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC256GBE-E530 | Flexxon | 2.7V~3.6V 2Tbit FBGA-100(14x18) NAND FLASH ROHS | C17480987 | FBGA-100(14x18) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 2Tbit | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5A-2001IX | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17504138 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | - | - | 256Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC53T016-ITJ | Insignis Technology Corporation | 2.7V~3.6V 128Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17475921 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 128Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTG7-T13-17 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17476460 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | - | 2.7V~3.6V | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | AF008GEC5A-2001EX | ATP Electronics, Inc. | 64Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17456597 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | - | - | 64Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | TC58BYG0S3HBAI4 | KIOXIA | 1.7V~1.95V 1Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17415149 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 25ns | 1.7V~1.95V | 1Gbit | - | ||
| | Min: 1 Mult: 1 | 0 | TC58BVG2S0HBAI4 | KIOXIA | 2.7V~3.6V 4Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17377447 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 25ns | 2.7V~3.6V | 4Gbit | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | FEMC032GBE-TC40 | Flexxon | 2.7V~3.6V 256Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17446164 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | - | 2.7V~3.6V | 256Gbit | - | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | MT29F8T08EWLEEM5-R:E TR | Micron Tech | NAND FLASH ROHS | C19759661 | - | Tape & Reel (TR) | - | - | - | - | - | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | MT29F512G08EBHAFJ4-3ITF:A TR | Micron Tech | VBGA-132(12x18) NAND FLASH ROHS | C19747081 | VBGA-132(12x18) | Tape & Reel (TR) | - | - | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | MT29F4G08ABAFAWP-AITES:F TR | Micron Tech | TSOPI-48 NAND FLASH ROHS | C19736500 | TSOPI-48 | Bag-packed | - | - | - | - | - |