NAND FLASH
The Results of NAND FLASH
2362
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2362
Images
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Pricing
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Quantity
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Availability
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Mfr.Part #
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Manufacturer
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Description
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RoHS
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LCSC Part#
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Package
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Packaging
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Operating Temperature
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Memory Size
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Write Cycle Time (tWC)
|
Supply Voltage
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Interface Type
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|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Memory Size
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Interface Type
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1 | 0 | AF032GEC5X-2001EX | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17359509 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 256Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | SDIN5B2-32G | SANDISK | 2.7V~3.6V 256Gbit TFBGA-169(12x18) NAND FLASH ROHS | C17371142 | TFBGA-169(12x18) | Tray | -25℃~+85℃ | 256Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | IS22TF16G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 128Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17367390 | VFBGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | 128Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC53K008-IT | Insignis Technology Corporation | 3.3V 8Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17346370 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 8Gbit | - | 3.3V | - | ||
| | Min: 1 Mult: 1 | 0 | W25N512GVPIT | Winbond Elec | 2.7V~3.6V 512Mbit WSON-8(5x6) NAND FLASH ROHS | C17351740 | WSON-8(5x6) | Tray | -40℃~+85℃ | 512Mbit | 700us | 2.7V~3.6V | SPI | ||
| | Min: 1 Mult: 1 | 0 | FEMC032GBG-T340 | Flexxon | 2.7V~3.6V 256Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17412076 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 256Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | W25N02KVTCIR | Winbond Elec | 2.7V~3.6V 2Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17388794 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 2Gbit | 700us | 2.7V~3.6V | SPI | ||
| | Min: 1 Mult: 1 | 0 | TC58BYG0S3HBAI4 | KIOXIA | 1.7V~1.95V 1Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17415149 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 1Gbit | 25ns | 1.7V~1.95V | - | ||
| | Min: 1 Mult: 1 | 0 | IS21TF128G-JQLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 1Tbit LFBGA-100(14x18) NAND FLASH ROHS | C17426172 | LFBGA-100(14x18) | Bag-packed | -40℃~+85℃ | 1Tbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5A-2001A2 | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17241118 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 256Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | AF128GEC5X-2001A3 | ATP Electronics, Inc. | 1Tbit BGA-153(11.5x13) NAND FLASH ROHS | C17226163 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 1Tbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | W25N512GWFIT | Winbond Elec | 1.7V~1.95V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17230855 | SOIC-16-300mil | Tray | -40℃~+85℃ | 512Mbit | 700us | 1.7V~1.95V | SPI | ||
| | Min: 1 Mult: 1 | 0 | FEMC064GBG-T340 | Flexxon | 2.7V~3.6V 512Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17225939 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 512Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5X-2001IX | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17299931 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 256Gbit | - | - | - | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS21TF64G-JQLI-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 512Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17304543 | LFBGA-100(14x18) | Tape & Reel (TR) | -40℃~+85℃ | 512Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC53T032-IT | Insignis Technology Corporation | 2.7V~3.6V 256Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17221196 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 256Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC064GBB-E530 | Flexxon | 2.7V~3.6V 512Gbit FBGA-100(14x18) NAND FLASH ROHS | C17227972 | FBGA-100(14x18) | Tray | -40℃~+105℃ | 512Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC00K016-IT | Insignis Technology Corporation | 3.3V 128Gbit BGA-100(14x18) NAND FLASH ROHS | C17227861 | BGA-100(14x18) | Tray | -40℃~+85℃ | 128Gbit | - | 3.3V | - | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N02JWSFIF TR | Winbond Elec | 1.7V~1.95V 2Gbit SOIC-16-300mil NAND FLASH ROHS | C17257015 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 2Gbit | 700us | 1.7V~1.95V | SPI | ||
| | Min: 1 Mult: 1 | 0 | W25N04KWZEIU | Winbond Elec | 1.7V~1.95V 4Gbit WSON-8(6x8) NAND FLASH ROHS | C17524857 | WSON-8(6x8) | Tube-packed | -40℃~+85℃ | 4Gbit | 700us | 1.7V~1.95V | SPI | ||
| | Min: 1 Mult: 1 | 0 | AS5F34G04SND-08LIN | Alliance Memory | 3V~3.6V 4Gbit LGA-8(6x8) NAND FLASH ROHS | C17656939 | LGA-8(6x8) | Tray | -40℃~+85℃ | 4Gbit | 700us | 3V~3.6V | SPI | ||
| | Min: 1 Mult: 1 | 0 | TH58NYG2S3HBAI4 | KIOXIA | 1.7V~1.95V 4Gbit BGA-63(9x11) NAND FLASH ROHS | C17671818 | BGA-63(9x11) | Tray | -40℃~+85℃ | 4Gbit | 25ns | 1.7V~1.95V | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | TC58BYG1S3HBAI4 | KIOXIA | 1.7V~1.95V 2Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17671495 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 2Gbit | 25ns | 1.7V~1.95V | - | ||
| | Min: 1 Mult: 1 | 0 | SM671PBF-BFSS | Silicon Motion | 4Tbit BGA-153(11.5x13) NAND FLASH ROHS | C17596185 | BGA-153(11.5x13) | Bag-packed | -40℃~+85℃ | 4Tbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | W25N01JWSFIT | Winbond Elec | 1.7V~1.95V 1Gbit SOIC-16-300mil NAND FLASH ROHS | C17615095 | SOIC-16-300mil | Tray | -40℃~+85℃ | 1Gbit | 700us | 1.7V~1.95V | SPI |