NAND FLASH
The Results of NAND FLASH
2357
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2357
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Memory Size
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Interface Type
|
|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Memory Size
|
Write Cycle Time (tWC)
|
Supply Voltage
|
Interface Type
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1 | 0 | AF016GEC5X-2001A2 | ATP Electronics, Inc. | 128Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17295813 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 128Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | IS22TF08G-JCLA1 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17296893 | VFBGA-153(11.5x13) | Tray | -40℃~+85℃ | 64Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | AF016GEC5A-2001EX | ATP Electronics, Inc. | 128Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17292999 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 128Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | IS21TF08G-JCLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17293707 | VFBGA-153(11.5x13) | Tray | -40℃~+85℃ | 64Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | MT29F4G08ABBFAM70A3WC1 | Micron Tech | 1.7V~1.95V 4Gbit NAND FLASH ROHS | C17281852 | - | Bag-packed | 0℃~+70℃ | 4Gbit | - | 1.7V~1.95V | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | IS34ML02G081-TLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17270026 | TFSOP-48-18.4mm | Bag-packed | -40℃~+85℃ | 2Gbit | 25ns | 2.7V~3.6V | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | W29N04KZBIBG | Winbond Elec | 1.7V~1.95V 4Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17275573 | VFBGA-63(9x11) | Tray | -40℃~+85℃ | 4Gbit | 35ns | 1.7V~1.95V | - | ||
| | Min: 1 Mult: 1 | 0 | SM671PBE-BFSS | Silicon Motion | 640Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17479318 | BGA-153(11.5x13) | Bag-packed | -40℃~+85℃ | 640Gbit | - | - | UFS2.1 | ||
| | Min: 1 Mult: 1 | 0 | NSEC53T016-ITJ | Insignis Technology Corporation | 2.7V~3.6V 128Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17475921 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 128Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTG7-T13-17 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17476460 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 64Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5A-2001IX | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17504138 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 256Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC256GBE-E530 | Flexxon | 2.7V~3.6V 2Tbit FBGA-100(14x18) NAND FLASH ROHS | C17480987 | FBGA-100(14x18) | Tray | -40℃~+85℃ | 2Tbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N512GWFIT TR | Winbond Elec | 1.7V~1.95V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17473624 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 512Mbit | 700us | 1.7V~1.95V | SPI | ||
| | Min: 1 Mult: 1 | 0 | MX60LF8G28AD-TI | MXIC(Macronix) | 2.7V~3.6V 8Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17469795 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 8Gbit | 700us | 2.7V~3.6V | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | IS21TF08G-JQLI | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17374242 | LFBGA-100(14x18) | Tray | -40℃~+85℃ | 64Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTG7-T13-16 | Flexxon | 2.7V~3.6V 64Gbit FBGA-100(14x18) NAND FLASH ROHS | C17367141 | FBGA-100(14x18) | Tray | -25℃~+85℃ | 64Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | W29N01HZDINF | Winbond Elec | 1.7V~1.95V 1Gbit VFBGA-48(8x6.5) NAND FLASH ROHS | C17371560 | VFBGA-48(8x6.5) | Tray | -40℃~+85℃ | 1Gbit | 25ns | 1.7V~1.95V | Parallel Port | ||
| | Min: 1 Mult: 1 | 0  | S34MS01G204BHI013 | Infineon/Cypress Semicon | 1.7V~1.95V 1Gbit BGA-63(9x11) NAND FLASH ROHS | C17334294 | BGA-63(9x11) | Bag-packed | -40℃~+85℃ | 1Gbit | 45ns | 1.7V~1.95V | Parallel Port | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | GD25Q20ESIGR | GigaDevice Semicon Beijing | 2.7V~3.6V 2Mbit SOIC-8-208mil NAND FLASH ROHS | C17338448 | SOIC-8-208mil | Tape & Reel (TR) | -40℃~+85℃ | 2Mbit | 70us | 2.7V~3.6V | SPI | ||
| | Min: 1 Mult: 1 | 0 | TH58NVG3S0HBAI6 | KIOXIA | 2.7V~3.6V 8Gbit VFBGA-67(6.5x8) NAND FLASH ROHS | C17270105 | VFBGA-67(6.5x8) | Tray | -40℃~+85℃ | 8Gbit | 25ns | 2.7V~3.6V | Parallel Port | ||
| | Min: 1 Mult: 1 | 0 | W29N02KZDIBE | Winbond Elec | 1.7V~1.95V 2Gbit VFBGA-48(8x6.5) NAND FLASH ROHS | C17360518 | VFBGA-48(8x6.5) | Tray | -40℃~+85℃ | 2Gbit | 25ns | 1.7V~1.95V | - | ||
| | Min: 1 Mult: 1 | 0 | AF032GEC5X-2001EX | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17359509 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 256Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | SDIN5B2-32G | SANDISK | 2.7V~3.6V 256Gbit TFBGA-169(12x18) NAND FLASH ROHS | C17371142 | TFBGA-169(12x18) | Tray | -25℃~+85℃ | 256Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | IS22TF16G-JCLA2 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 128Gbit VFBGA-153(11.5x13) NAND FLASH ROHS | C17367390 | VFBGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | 128Gbit | - | 2.7V~3.6V | - | ||
| | Min: 1 Mult: 1 | 0 | NSEC53K008-IT | Insignis Technology Corporation | 3.3V 8Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17346370 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 8Gbit | - | 3.3V | - |