NAND FLASH
The Results of NAND FLASH
2354
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2354
Images
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Pricing
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Quantity
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Availability
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Mfr.Part #
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Manufacturer
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Description
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RoHS
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LCSC Part#
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Package
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Packaging
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Operating Temperature
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Memory Size
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Interface Type
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Write Cycle Time (tWC)
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Supply Voltage
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|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Memory Size
|
Interface Type
|
Write Cycle Time (tWC)
|
Supply Voltage
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1 | 0 | AF016GEC5X-2001A3 | ATP Electronics, Inc. | 128Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17289496 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 128Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | SM671PAD-BFSS | Silicon Motion | 320Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17306736 | BGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | 320Gbit | UFS2.1 | - | - | ||
| | Min: 1 Mult: 1 | 0  | S34ML01G200BHV000 | Infineon/Cypress Semicon | 2.7V~3.6V 1Gbit BGA-63(9x11) NAND FLASH ROHS | C17304518 | BGA-63(9x11) | Tray | -40℃~+105℃ | 1Gbit | Parallel Port | 25ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | FEMC004GTTE7-T14-16 | Flexxon | 2.7V~3.6V 32Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17569066 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 32Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | TH58BVG3S0HTA00 | KIOXIA | 2.7V~3.6V 8Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17563206 | TFSOP-48-18.4mm | Tray | 0℃~+70℃ | 8Gbit | Parallel Port | 25ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | MT29F8G08ABBCAM71M3WC1L | Micron Tech | 1.7V~1.95V 8Gbit NAND FLASH ROHS | C17698132 | - | Box-packed | 0℃~+70℃ | 8Gbit | - | 25ns | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | W25N02KWTBIR | Winbond Elec | 1.7V~1.95V 2Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17691816 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 2Gbit | SPI | 700us | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | NSEC53K016-IT | Insignis Technology Corporation | 3.3V 16Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17692646 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 16Gbit | - | - | 3.3V | ||
| | Min: 1 Mult: 1 | 0 | W25N512GVEIR | Winbond Elec | 2.7V~3.6V 512Mbit WSON-8(6x8) NAND FLASH ROHS | C17656587 | WSON-8(6x8) | Tray | -40℃~+85℃ | 512Mbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | MT29F8G08ABACAM71M3WC1L | Micron Tech | 2.7V~3.6V 8Gbit NAND FLASH ROHS | C17665269 | - | Box-packed | 0℃~+70℃ | 8Gbit | - | 20ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | AF016GEC5X-2001EX | ATP Electronics, Inc. | 128Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17657487 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 128Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | TC58BYG0S3HBAI6 | KIOXIA | 1.7V~1.95V 1Gbit VFBGA-67(6.5x8) NAND FLASH ROHS | C17659935 | VFBGA-67(6.5x8) | Tray | -40℃~+85℃ | 1Gbit | Parallel Port | 25ns | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | W25N02JWTBIF | Winbond Elec | 1.7V~1.95V 2Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17608676 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 2Gbit | SPI | 700us | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | SM671PAE-BFSS | Silicon Motion | 640Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17609377 | BGA-153(11.5x13) | Bag-packed | -40℃~+105℃ | 640Gbit | UFS2.1 | - | - | ||
| | Min: 1 Mult: 1 | 0 | TH58BVG2S3HTA00 | KIOXIA | 2.7V~3.6V 4Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17677778 | TFSOP-48-18.4mm | Tray | 0℃~+70℃ | 4Gbit | Parallel Port | 25ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | IS34MW02G084-BLI | ISSI(Integrated Silicon Solution) | 1.7V~1.95V 2Gbit VFBGA-63(9x11) NAND FLASH ROHS | C17684465 | VFBGA-63(9x11) | Bag-packed | -40℃~+85℃ | 2Gbit | Parallel Port | 45ns | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | AF064GEC5A-2001A2 | ATP Electronics, Inc. | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17642790 | BGA-153(11.5x13) | Tray | -40℃~+105℃ | 512Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | W25N512GVFIG | Winbond Elec | 2.7V~3.6V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17617589 | SOIC-16-300mil | Tray | -40℃~+85℃ | 512Mbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTG7-T14-17 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17614482 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 64Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N512GVFIR TR | Winbond Elec | 2.7V~3.6V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17614613 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 512Mbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W25N512GVFIT | Winbond Elec | 2.7V~3.6V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17581552 | SOIC-16-300mil | Tray | -40℃~+85℃ | 512Mbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | IS22TF08G-JQLA1 | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 64Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17601470 | LFBGA-100(14x18) | Bag-packed | -40℃~+85℃ | 64Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1
Full Reel: 3000
| 0 | GD25Q20ETIGR | GigaDevice Semicon Beijing | 2.7V~3.6V 2Mbit SOP-8 NAND FLASH ROHS | C17490656 | SOP-8 | Tape & Reel (TR) | -40℃~+85℃ | 2Mbit | SPI | 70us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | W25N01GVTBIG TR | Winbond Elec | 2.7V~3.6V 1Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17491636 | TFBGA-24(6x8) | Tape & Reel (TR) | -40℃~+85℃ | 1Gbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GTTE7-T14-17 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17494522 | FBGA-153(11.5x13) | Tray | -40℃~+85℃ | 64Gbit | - | - | 2.7V~3.6V |