NAND FLASH
The Results of NAND FLASH
2347
Manufacturer
Package
Operating Temperature
Data Retention - TDR (Year)
Page Program time (Tprog)
Memory Size
Write Cycle Time (tWC)
Block Erase Time (tBE)
Supply Voltage
Clock Frequency (fc)
Interface Type
Results:
2347
Images
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Pricing
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Quantity
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Availability
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Mfr.Part #
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Manufacturer
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Description
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RoHS
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LCSC Part#
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Package
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Packaging
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Operating Temperature
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Memory Size
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Interface Type
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Write Cycle Time (tWC)
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Supply Voltage
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|---|
Images
|
Pricing
|
Quantity
|
Availability
|
Mfr.Part #
|
Manufacturer
|
Description
|
RoHS
|
LCSC Part#
|
Package
|
Packaging
|
Operating Temperature
|
Memory Size
|
Interface Type
|
Write Cycle Time (tWC)
|
Supply Voltage
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| | Min: 1 Mult: 1 | 0 | AF032GEC5A-2001A3 | ATP Electronics, Inc. | 256Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17430935 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 256Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | SM671PEE-BFSS | Silicon Motion | 640Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17439930 | BGA-153(11.5x13) | Bag-packed | -40℃~+85℃ | 640Gbit | UFS2.1 | - | - | ||
| | Min: 1 Mult: 1 | 0 | AF064GEC5A-2001A3 | ATP Electronics, Inc. | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17441000 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 512Gbit | - | - | - | ||
| | Min: 1 Mult: 1
Full Reel: 2000
| 0 | ASFC8G31M-51BINTR | Alliance Memory | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17434601 | FBGA-153(11.5x13) | Tape & Reel (TR) | -40℃~+85℃ | 64Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | TC58BVG1S3HTAI0 | KIOXIA | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17434703 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 2Gbit | Parallel Port | 25ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W29N02KVSIAE | Winbond Elec | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17413188 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 2Gbit | - | 25ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W25N01GVSFIT | Winbond Elec | 2.7V~3.6V 1Gbit SOIC-16-300mil NAND FLASH ROHS | C17527838 | SOIC-16-300mil | Tray | -40℃~+85℃ | 1Gbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | AF064GEC5X-2001A3 | ATP Electronics, Inc. | 512Gbit BGA-153(11.5x13) NAND FLASH ROHS | C17480649 | BGA-153(11.5x13) | Tray | -40℃~+85℃ | 512Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | SM671PXE-BFST | Silicon Motion | 2Tbit BGA-153(11.5x13) NAND FLASH ROHS | C17514214 | BGA-153(11.5x13) | Bag-packed | -25℃~+85℃ | 2Tbit | UFS2.1 | - | - | ||
| | Min: 1 Mult: 1
Full Reel: 1500
| 0 | W29N01HZSINA TR | Winbond Elec | 1.7V~1.95V 1Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17505925 | TFSOP-48-18.4mm | Tape & Reel (TR) | -40℃~+85℃ | 1Gbit | - | 25ns | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | TC58NYG1S3HBAI4 | KIOXIA | 1.7V~1.95V 2Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17291284 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 2Gbit | - | 25ns | 1.7V~1.95V | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N512GVFIT TR | Winbond Elec | 2.7V~3.6V 512Mbit SOIC-16-300mil NAND FLASH ROHS | C17293069 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 512Mbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | W25N02JWSFIC TR | Winbond Elec | 1.7V~1.95V 2Gbit SOIC-16-300mil NAND FLASH ROHS | C17376747 | SOIC-16-300mil | Tape & Reel (TR) | -40℃~+85℃ | 2Gbit | SPI | 700us | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | FEMC008GBG-T340 | Flexxon | 2.7V~3.6V 64Gbit FBGA-153(11.5x13) NAND FLASH ROHS | C17314468 | FBGA-153(11.5x13) | Tray | -25℃~+85℃ | 64Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W25N02KVZEIU | Winbond Elec | 2.7V~3.6V 2Gbit WSON-8(6x8) NAND FLASH ROHS | C17395635 | WSON-8(6x8) | Tube-packed | -40℃~+85℃ | 2Gbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W25N01GVTBIG | Winbond Elec | 2.7V~3.6V 1Gbit TFBGA-24(6x8) NAND FLASH ROHS | C17410662 | TFBGA-24(6x8) | Tray | -40℃~+85℃ | 1Gbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | TH58BYG2S3HBAI4 | KIOXIA | 4Gbit TFBGA-63(9x11) NAND FLASH ROHS | C17346277 | TFBGA-63(9x11) | Tray | -40℃~+85℃ | 4Gbit | - | - | - | ||
| | Min: 1 Mult: 1 | 0 | FEMC064GBE-E530 | Flexxon | 2.7V~3.6V 512Gbit FBGA-100(14x18) NAND FLASH ROHS | C17346363 | FBGA-100(14x18) | Tray | -40℃~+85℃ | 512Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W29N01HZSINF | Winbond Elec | 1.7V~1.95V 1Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17302219 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 1Gbit | Parallel Port | 25ns | 1.7V~1.95V | ||
| | Min: 1 Mult: 1 | 0 | MX30LF2GE8AB-TI | MXIC(Macronix) | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17317721 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 2Gbit | Parallel Port | 20ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W25N512GVPIG | Winbond Elec | 2.7V~3.6V 512Mbit WSON-8(5x6) NAND FLASH ROHS | C17328272 | WSON-8(5x6) | Tray | -40℃~+85℃ | 512Mbit | SPI | 700us | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | SFEM032GB1ED1TO-I-5E-311-STD | Swissbit | 2.7V~3.6V 256Gbit BGA-100(14x18) NAND FLASH ROHS | C17329155 | BGA-100(14x18) | Tray | -40℃~+85℃ | 256Gbit | - | - | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | MX30LF2G28AC-TI | MXIC(Macronix) | 2.7V~3.6V 2Gbit TFSOP-48-18.4mm NAND FLASH ROHS | C17337442 | TFSOP-48-18.4mm | Tray | -40℃~+85℃ | 2Gbit | Parallel Port | 20ns | 2.7V~3.6V | ||
| | Min: 1 Mult: 1 | 0 | W25N02JWSFIC | Winbond Elec | 1.7V~1.95V 2Gbit SOIC-16-300mil NAND FLASH ROHS | C17349167 | SOIC-16-300mil | Tray | -40℃~+85℃ | 2Gbit | SPI | 700us | 1.7V~1.95V | ||
| | Min: 1 Mult: 1
Full Reel: 1000
| 0 | IS21TF32G-JQLI-TR | ISSI(Integrated Silicon Solution) | 2.7V~3.6V 256Gbit LFBGA-100(14x18) NAND FLASH ROHS | C17563769 | LFBGA-100(14x18) | Tape & Reel (TR) | -40℃~+85℃ | 256Gbit | - | - | 2.7V~3.6V |